Literature

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1989 Temperature Dependence of the Capture Cross Section of Seo as Measured by Microwave Absorption Spectroscopy (MAS) by T.Pavelka and *B.Hemm, Materials Science Forum Vols. 38-41, 469-472
1989 Interpretation of the Electric Field Dependent Thermal Emission Data of Deep Traps T.Pavelka and G.Ferenczi, Materials Science Forum Vols.38-41, 803-808
1989 Dispersive Microwave Transient Spectroscopy of Deep Levels in Semiconductors by D.Huber, P.Eichinger, G.Ferenczi, T.Pavelka, G.Veszely, Materials Science and Engineering, B4
1990 DLTS Investigation of Deep Levels in Bulk GaAs under Uniaxial Stress by C.A.Londos, T.Pavelka, Semicond. Sci. Technol., 5, 1100-1104
1991 Injection Level Spectroscopy: A Novel Non-Contact Contamination Analysis Technique in Silicon by G.Ferenczi, T.Pavelka, P.Tütto, Japanese Journ. of Applied Physics, 30, No.12B, 3630-3633
1991 Improved Method for Depth Profiling of Multilayer Structures by T.S.Horányi, P.Tütto, G.Endrédi, Applied Surface Science, 50, 143-148
1991 Electrochemical Method for the Measurement of Doping Profiles in Silicon by T.S.Horányi, P.Tütto, G.Endrédi, Proceedings of the 3rd European Conference on Crystal Growth, May 5-11
1993 Ballistic Electron Emission Microscopy of Schottky Diodes on RF-Plasma-Treated Silicon by L.Quattropani, K.Solt, P.Niedermann, I.Maggio-Aprile, O. Fischer, T.Pavelka, Applied Surface Science,70/71, 391-395
1993 Electrochemical Etching and Profiling of Silicon by T.S.Horányi, P.Tütto, Applied Surface Science, 63, 316-321
1993 In Situ Bulk Lifetime Measurement on Silicon with a Chemically Passivated Surface by T.S.Horányi, T.Pavelka, P.Tütto, Applied Surface Science, 63, 306-311
1993 Investigation of Recombination Properties of Ti Double Donor in Silicon by G.Ferenczi, T.Pavelka, P.Tütto, L.Köster, Solid State Phenomena, 32-33, 609-614
1996 Identification Possibility of Metallic Impurities in p-Type Silicon by Lifetime Measurement by T.S.Horányi, P. Tütto, Cs.Kovacsics, J. Electrochem. Soc., 143, No. 1, 216-220
1996 New Possibilities for the Microwave Photoconductive Decay Technique by T. Pavelka, Semiconductor Fabtech, 4th Edition, 247-249
1997 Charge Carrier Lifetime Modification in Silicon by High Energy H+, He+ Ion Implantation by N.Q. Khanh, P. Tütto, E.N. Jaroli, O.Buiu, L.P. Biro, F.Paszti, T.Mohacsy, Cs.Kovacsics, A.Manuaba, J.Gyulai, Materials Science Forum, 248-249, 101-103
1997 Charge Carrier Lifetime Modification in Silicon by High Energy H+or He+ Ion by N.Q.Khanh, P.Tutto, E.N.Jaroli, O.Buiu, L.P.Biro, A.Manuaba, and J.Gyulai, Nucl. Inst. Meth. B127-128, 388-392.
1998 Problems and Possibilities of Comparing Different Lifetime Measuring Instruments and Techniques by T. Pavelka, Recombination Lifetime Measurements in Silicon, ASTM publication # STP 1340, D.C. Gupta, F.R. Bacher, W.M. Hughes, Eds., America Society for Testing and Materials, 206-216
2000 Qualification of Epi Layers and Interface Properties by an Improved µ-PCD Technique by T. Pavelka, Gate Dielectric Integrity: Material, Process and Tool Qualification, ASTM STP 1382, D.C. Gupta and G.A. Brown, Eds., American Society for Testing and Materials, 145-154
2000 Investigation of Deep Levels and Precipitates Related to Molybdenum in Silicon by DLTS and Scanning Infrared Microscopy by B. Sandhu, T. Ogikubo, H. Goto, V. Csapo, T. Pavelka, Journ. of Crystal Growth, 210, 116-121
2000 Analytical Tools for the Characterization of Power Devices by H-J. Schulze, A. Frohnmeyer, F-J. Niedernostheide, B. Simmnacher, B.O. Kolbesen, P. Tutto, T. Pavelka, G. Wachutka: J. Electrochem. Soc., 147 (10), pp. 3879-3888
2000 Carrier lifetime control and characterization of high-resistivity silicon used for high-power devices by H-J. Schulze, A. Frohnmeyer, F-J. Niedernostheide, F. Hille, T. Pavelka, G. Wachutka, Proceedings of 198th Meeting of the Electrochemical Society, Phoenix
2001 Carrier lifetime analysis by photoconductive decay and free carrier absorption measurements by H-J. Schulze, A. Frohnmeyer, F.-J. Niedernostheide, F. Hille, P. Tutto, T. Pavelka, G. Wachutka, submitted to J. Electrochem. Soc.148 (2001) 11, p. G655.-G661.
2003 Silicon Epitaxial Layer Recombination and Generation Lifetime Characterization by D.K. Schroder, B.D. Choi, S.G. Kang, W. Ohashi, K. Kitahara, G. Opposits, T. Pavelka, J. Benton, IEEE Transactions on Electron Devices, Vol. 50, No.4, pp 906.
2005 Quantitative copper measurement in oxidized p-type silicon wafers using microwave photoconductivity decay by H. Vainola, E. Saarnilehto, M. Yli-Koski, A. Haarahiltunen, J. Sinkkonen, G. Berenyi, T. Pavelka, Appl. Phys. Letters 87, 032109
2005 Measurement of copper in p-type silicon using charge-carrier lifetime methods by M. Yli-Koski, H. Savin, E. Saarnilehto, A. Haarahiltunen, J. Sinkkonen, G. Berenyi, T. Pavelka, Solid State Phenomena Vols. 108-109 pp. 643-648
2007 Monitoring plasma nitridation of HfSiOx by corona charge measurements by J-L. Everaert, X. Shi, A. Rothschild, M. Schaekers, E. Rosseel, T. Pavelka, E. Don, S. Vanhaelemeersch, Microelectronic Engeneering, 84, 2251-2254
2008 Nanomechanical properties of ion-implanted Si by P. M. Nagy, D. Aranyi, P. Horvath, G. Peto, E. Kalman, Surface and Interface Analysis, Vol. 40, Issue 3-4, p 875-880, 10 March, 2008
2008 Determining of sheet resistance of implanted wafers with technique of non-contact junction photovoltage measurement  
2005 Determination of electrically Active Surface Dopant Density in Ultra-Shallow Junction (USJ) Structures with a Non-Destructive Elastic Material Probe (EM-Probe) R. J. Hillard, M. V. Benjamin, W. C. Ye, J. O Borland
2005 Recent Developments in Electrical Metrology for MOS Fabrication R. J. Hillard, M. C. Benjamin, G. A. Brown,
2006 45nm Node p+ USJ Formation With High Dopant Activation And Low Damage by J. Borland, S. Shishiguchi, A. Mineji, W. Krull, D. Jacobson, M. Tanjyo, W. Lerch, S. Paul, J. Gelpey, S. McCoy, J. Venturini, M. Current, V. Faifer, R. Hillard, M. Benjamin, T. Walker, A. Buczkowski, Z. Li, J. Chen
? Product wafer monitoring of ultra-shallow channel implants with an elastic metal gate (EM-gate) R. J. Hillard, W. H. Howland, R. G. Mazur, W. Ye, N. K. Variam,
1995 Element Specific Diagnosis Using Microwave Reflection Photoconductive Decay by L. Köster, P. Blöchl, L. Fábry, in Jpn. J. Appl. Phys., Vol. 34(1995), pp. 932-936
1998 Contamination reduction and control in integrated circiut manufacturing by J. E. Steinle, in TI Technical Journal, Engineering Quality, April-June, 1998
1999 Gettering of Unintentionally Contaminated Silicon Wafers by Phosphorous Ion Implantation and Annealing by M.Yli-Koski, J. Mellin, V. Ovchinnikov, in Solid-State Phenomena, Vols. 69-70, pp. 291-294.
1999 Evaluation of precipitation and denuded zone depth on different silicon materials by J. E. Steinle, in TI Technical Journal, Engineering Technology, April-June, 1999
2001 Surface Passivation Effect of Silicon Substrates due to Quinhydrone/Ethanol Treatment by Hidetaka Takato, Isao Sakata, Rzuichi Shimokawa, Jpn. J. Appl. Phys. Vol 40(2001) pp. L1003-L1004, Part2, No 10A, 1 Oct. 2001
2001 Process induced oxide and interface charges and their reactivity with carriers in bulk silicon by J. E. Steinle, in TI Technical Journal, Engineering Technology, 2001
2002 Contactless surface charge semiconductor characterization by d. K. Schröder, in Materials Science & Engineering B91-92 (2002), 192-210
2002 Detection of low-level copper contamination in p-type silicon by means of microwave photoconductive decay measurements by M.Yil-Koski, M. Palokangas, A. Haarahiltunen, H. Vainöla, J. Storgards, H. Holmberg, J. Sinkkonen, in J. Phys.: Condensed Matter, 14 (2002), 13119-13125
2003 Determination of Metallic Impurities in a Silicon Wafer by Local Etching and Electrothermal Atomic Absorption Spectrometry by H-Y. Chung, S-H Lee, Y-H. Kim, K-S. Lee, D-H. Kim, in Analytical Sciences, The Japan Society for Analytical Chemistry, Vol. 19, July 2003, pp. 1051-1054
2003 Improvements in PV performance and Yield (INSPIRE)
Report of a project carried out under the DTI's New and Renewable Energy Programme
by B.J. Garrad, in ... Crown, 14/01/2003
2007 Three dimensional mapping of thermal and tunneling electron emission from InAs/GaAs quantum dots O. Engström, M.Kaniewska, W.Jung, M.Kaczmarczyk, Appl.Phys.Letters 91, 033110 (published online 19 July 2007)
1999 Lifetime Measurements in SOI and Epi Structures by T. Pavelka, Z. Batari, Analytical and Diagnostic Techniques for Semiconductor Materials, Devices and Processes, Proceedings of ALTECH 99, Leuven, Belgium, Electrochemical Society Proceedings Volume 99-16, 48-55.
1999 Determination of Recombination Center Parameters by the Combined Application of µ-PCD and SPV Techniques by T. Pavelka, A. Toth, G. Bayer, Proceedings of the Diagnostic Techniques for Semiconductor Materials and Devices, (1999 Joint Int. Meeting, 196th Meeting of The Electrochemical Society (ECS) and the 1999 Fall Meeting of The Electrochemical Society of Japan (ECSJ), Honolulu, Hawaii, Oct. 17-22, 1999., Abstract No. 1370.
1999 Temperature dependence of carrier recombination lifetimes in n-type silicon by Frohnmeyer, F.-J. Niedernostheide, H.-J. Schulze, P. Tütto, T. Pavelka, G. Wachutka, Proceedings of the International Semiconductor Device Research Symposium (Charlottesville 1999), pp. 539-542
2001 Reflection mode scanning infrared microscope (SIRM) and its applications to defect detection in silicon
(Scanning Infrared Microscope and Its Application in Silicon)
by Cs. Kovacsics, DRIP IX Conference (Sept. 2001), Poster Sessions, P1-B: Defects in Silicon, P1-14
2003 Comparative Study on Emitter Sheet Resitivity Measurements for Inline Quality Control by E. Rüland, P. Fath, T. Pavelka, A. Pap, K. Peter, J. Mizsei, Proceedings of the 3rd World Conference on Photovoltaic Solar Energy Conversion, Osaka
2005 Microwave photoconductive decay mapping and investigation of lifetimes in 4H-SiC epitaxial layers by J. D. Cadwell, A. Pap, A. Shrivastava, Z. Zhang, P.B. Klein, T. Pavelka, T. Sudarshan, O.J. Glembocki, K. Hobart, F. Kub, Presented at Int. Conf. on Silicon Carbide and Related Materials (ICSCRM 2005), Pittsburgh, USA
2006 Metrology and high resolution mapping of shallow junctions formed by low energy implant processes by E. Don, A. Pap, T. Pavelka, P. Tutto, C. Wyon, C. Laviron, R. Oechsner, M. Pfeffer, Proceedings of Conf. on Ion Implant Technology (IIT 2006), Marseille, France, CP866, Ion Implantation technology, American Inst. Of Physics, 534-537.
2006 Carrier Lifetime Mapping and Lifetime studies of 4H-SiC Epilayers by J. D. Caldwell, P. B. Klein, O. Glembocki, K. Hobart, F. Kub, A. Pap, T. Pavelka, A. Shrivastava, Z. Zhang, T. Sudarshan, G. Webster, Materials Research Society MRS, Spring Meeting
2007 Carrier Lifetime Measurements in Silicon for Photovoltaic Applications by T. Pavelka, A. Pap, Gy. Szilágyi, 212th ECS Meeting, October 7-12, Washington, DC
2007 Improvements to High Resolution Mapping of Junction Photovoltage Measured Sheet resistance by Correcting for wafer edge and compensating for junction leakage by E. Don, C. Kohn, A. Pap, P. Tutto, T. Pavelka, C. Laviron, C. Wyon, R. Oechsner, M. Pfeffer , 6-9 May 2007 at INSIGHT 2007 Conference, Napa Valley, USA
2007 High Resolution Mapping of Sheet Resistance reveal implanter or anneal non-uniformities by , SEMI Seminars, 19th July 2007, San Francisco, USA, West Coast Junction Technology Group, USJ metrology seminar
2007 Metrology, Analysis and Charaterization in Micro- and Nanotechnologies - A European Challenge L. Pfitzner, A. Nutsch, R. Oechsner, M. Pfeffer, E. Don, C. Wylon, M. Hurlebaus, in proceedings of Analytical Techniques for Semiconductor Materials and Process Characterization 5 (ALTECH 2007), pages 35-
2008 Junction Photovoltage Metrology and high resolution mapping of ion implants electrically isolated from wafer surface by Dr. Eric Don, A. Pap, T. Pavelka, C. Wyon, C. Laviron, R. Oechsner, M. Pfeffer, Ion Implantation Technology Conference, Monterey, California, 8th – 13th June
2008 Ultra Shallow Junctions fabrication by Plasma Immersion Implantation on PULSION® followed by Spike and/or Flash Annealing. Effect of pre-amorphization and co-implantation on Boron diffusion in Silicon by H. Etienne, F. Torregrosa, G. Semoere, G. Mathieu, L. Roux, F. Cristiano, P. Fazzini, W. Lerch, S. Paul, J. Gelpey, F. Milesi, F. Gonzatti, A. Pap, K. Kis-Szabo, T. Pavelka, E-MRS Spring Meeting, Strasbourg, France, May 26 - May 30
2008 Fabrication and acharacterisation challenges on Ultra Shallow Junctions for sub 45 nm CMOS devices. by F. Torregrosa, H. Etienne, G. Sempere, G. Mathieu, L. Roux, C. Grosjean, R. Daineche, Y. De Puydt, L. Dupuy, P. Galand, A. Pap, K. Kis-Szabo, T. Pavelka, 11th Technical & Scientific Meeting of ARCSIS, 20-21 Nov., STUniversity in Fuveau, France (2008)
2009 Comparison of Silicon Surface Preparation Methods for Measurement of Minority Carrier Lifetime Using the Microwave Photoconductive Decay (?-PCD) Coupled with Continuous Corona Charge (Charge-PCD) T. Pavelka, Á. Pap, P. Kenesei, M. Varga, F. Novinics, M. Tallián, G. Borionetti, G. Guaglio, M. Pfeffer, and E. Don in ECS Transactions Volume 25, Issue No. 3, Analytical Techniques for Semiconductor Materials and Process Characterization 6 (ALTECH 2009)
2008 Control of Laser Induced Interface Traps with In-line Corona Charge Metrology DRAFT for IEEE 2008.08.28. by J-L. Everaert, E. Rosseel, C. Ortolland, M. Aoulaiche, T. Hoffmann, T. Pavelka, E. Don
1997 Process Monitoring of Ultrathin Oxides using Surface Charge Analysis by A. H. Field, In-line characterization techniques for performance and yield enhancement in microelectronic manufacturing, Conference, Austin TX, USA(01/10/1997), vol. 3215, pp. 10-16
2004 Measurements of Ultra-Shallow Junction (USJ) Sheet Resistance with a Non-Penetrating Four Point Probe by R. J. Hillard, R. G. Mazur, W. J. Alexander, C. Win Ye, M. C. Benjamin, J. O. Borland, Materials Research Society MRS Symposium Proceedings vol. 810
2004 Accurate Determination of Ultra-Shallow Junction Sheet Resistance with a Non-Penetrating Four Point Probe R. J. Hillard, J. Borland, C. Win Ye, in Junction Technology, 2004. IWJT '04. The Fourth International Workshop on, pp. 98-101
2004 Accurate Determination of Ultra-Shallow Junction Sheet Resistance with a Non-Penetrating Four Point Probe R. J. Hillard, C. Win Ye, L. Tan, M. C. Benjamin, R. G. Mazur, SEMICON® West, SEMI® Technical Symposium: Innovations in Semiconductor Manufacturing, Semiconductor Equipment and Materials International, ISBN # 1-892568-79-9
2005 Ultra Low Energy (ULE) Implant Dose & Activation Monitoring by J. Borland, R. Hillard, M. Benjamin, E. Gurer, Junction Technologz, 2005. Extended Abstracts if the Fifth International Workshop on, pp 49-52
2007 Determination of implant activation and junction leakage with a non-penetrating and non-damaging elastic material probe (EM-Probe) by Robert J. Hillard, Mark Benjamin, John O. Borland, International Workshop on INSIGHT in Semiconductor Device Fabrication, Metrology, and Modeling (INSIGHT-2007), May 6 - 9, 2007, Napa, California
2007 Determination of Activated Dopant Profiles with a Novel FastGate® Probe by Robert J. Hillard, C. Win Ye, Mark C. Benjamin, Kyoichi Suguro, Junction Technology, 2007 International Workshop on, pp 47-48
1993 A New Method for Simultaneous Characterisation of Process Cleanliness and True Particle Removal Efficiency N.E. Henelius, H. Ronkainen, O. J. Anttila, J.M. Molarius, in Proceedings of the Thied International Symposium on Cleaning Technology in Semiconductor Device Manufacturing (Oct. 1993), Vol 94-07, pages 434-441
1997 Monitoring of Noble Metals in HF Based Chemistries by u-PCD, SPV, SCI and SCP A. Daniel, U. Straube, G. Kamarinos, E. Kamieniecki, F. Tradif, Cleaning Technology in Semiconductor Device Manufacturing, proceeding of the Fifth International Symposium (Sept. 1997), Vol. 97-35, pages 400-4007
1999 Evaluation of Advanced Pre-Gate Cleanings C.Cowache, P. Boelen, I. Kashkoush, P Besson, F. Tardif, in Cleaning Technology in Semiconductor Device Manufacturing, Proceedings of the Sixth International Symposium (Oct.1999), Vol. 99-36,pages 59-68
2000 Lifetime mapping of Si Wafers by an Infrared Camera by M. Bail, J. Kentsch, R. Brendel, M. Schulz, in Proceeding of the 28th IEEE Photovoltaic Specialists Conference, (IEEE NewYork 2000.) p 99.
2000 Low-Cost High Efficient Milticrystalline Silicon for Photovoltaics by M. B. I Diaz, C. Haessler, in proceedings of the 6th energie "Marie-Curie" Research Training Fellowship Conference, Paris, May, 2000.
2004 First Results of the Solarcentre Erfurt - a New Pertner in Photovoltaic Research S.Dauwe, L. Mittelstadt, A. Lawerenz, H.J.Freitag,C. Beneking, H.Aulich, Poster of 19th European Photovoltaic Solar Energy Conference and Exhibition (7-11 June 2004, Paris, France)
2005 Making Use of Silicon Wafers with Low Lifetimes by Adequate POCl3 Diffusion J. Lossen, L. Mittelstadt, S. Dauwe, K. Lauer, C. Beneking