The combination of the ion implant process and the process to anneal implants is usually monitored by measuring the sheet resistance of the implanted layer.  The sheet resistance varies with dose, energy, and the amount of implanted species that has become electrically active, and it is the sheet resistance that ultimate determines the device performance.  Thus, measuring sheet resistance is an excellent way to monitor everything associated with an implant process.

Semilab offers a technology, called JPV, to make non-contact, high resolution, fast maps of sheet resistance.  Measurements of sheet resistance, via JPV, are available in Semilab’s WT-2000 Multifunction Wafer Mapping Tool and Semilab’s WT-3000 dual FOUP tool for 300mm wafers.