| Highlights: |
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High speed |
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High depth resolution
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Detectable particle size down to 12nm
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| System Specifications |
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DZ determination from one image concentration distribution along the wafer diameter within minutes |
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Depth resolution: 0.5µm
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First particle detected within 0.5µm from the surface
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Fully automatic operation including half wafer handling
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Wafer diameter up to 12 inch
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Whole wafer diameter scan image size: 400 µm x 2mm with measuring time of 50 seconds
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Autofocusing on the cleaved surface
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Weight: max. 350 kg
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Dimensions:
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width:1400 mm |
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depth:1200 mm |
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height:1800 mm
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| Facility Requirements |
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Power requirement: max. 800 W, 100-240 V, 50/60 Hz
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Vacuum: 0-0.3 bar, max. 1-2 l/min |
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Temperature of operation: 23°C ± 3°C; 1°C/hour
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Cleanroom: better or equal to Class 10000
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